Yam dab tsi cuam tshuam rau cov qauv ntawm txheej txheej electroplating ntawm seedbed net
Cov muaj pes tsawg leeg ntawm seedbed net ua los ntawm cov tshuaj electroplating muaj ib qho tseem ceeb ntawm cov qauv ntawm electroplating txheej ntawm seedbed net, thiab nws lub ntsiab muaj pes tsawg leeg yog raws li nram no. Thawj ntsev muaj peev xwm tso cov ntsev xav tau ntawm cov txheej hlau ntawm lub cathode. Tus neeg sawv cev complexing tuaj yeem tsim ib txoj hauv kev nrog cov hlau ions sau hauv cov tshuaj. Conductive salts tuaj yeem txhim kho cov conductivity ntawm cov tshuaj, tab sis tsis muaj kev cuam tshuam rau kev tawm ntawm cov hlau ions. Buffers yog siv los tswj cov pH ntawm cov tshuaj, tshwj xeeb tshaj yog nyob ze ntawm lub cathode.
Stabilizers zam hydrolysis ntawm cov ntsev loj hauv da dej lossis oxidation ntawm cov hlau ions, tswj kev daws teeb meem thiab kev ruaj ntseg. Anode activators tuaj yeem tshem tawm lossis txo cov anode polarization thaum electroplating. Nws tuaj yeem txhawb qhov kev sib cais ntawm cov anode thiab ua kom cov anode tam sim no ceev. Cov ntsiab lus ntawm additives nyob rau hauv da dej yog tsawg heev, uas muaj ib tug tseem ceeb cov nyhuv ntawm lub da dej thiab txheej. Piv txwv li: brighteners, leveling agents, wetting agents, stress relievers, coating scavengers, pos inhibitors, etc.
